Description
Product details
This advanced digital array conference unit integrates DSP/DDOV digital processing technology powered by a stable IRIN chip, ensuring precise signal transmission and seamless audio handling. The dual backup design supports both hand-in-hand conferencing and phantom power output, providing robust redundancy. The microphone stem is engineered with 32,500 high-density acoustic interference holes for superior voice pickup, enhanced further by automatic gain control (AGC). It supports multiple conference modes including FIFO, LIFO, voice activation, and free discussion, making it ideal for dynamic meeting environments. With magnetic pluggable microphone poles, touch-sensitive controls, and smart digital ID addressing, the system ensures high-fidelity audio capture and seamless integration with speech recognition platforms. Advanced DSP/DDOV Technology Dual Backup Design Precision Microphone Design High-Sensitivity Pickup Shielded Cabling Flexible Conference Modes Magnetic Microphone Pole Touch Controls Smart ID Addressing
